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1

Device-to-device communications in cellular networks

Feng, Daquan, Lu, Lu, Yuan-Wu, Yi, Li, Geoffrey, Li, Shaoqian, Feng, Gang

Journal:

IEEE Communications Magazine

Year:

2014

Language:

english

File:

PDF, 228 KB

english, 2014

2

A survey of energy-efficient wireless communications

Daquan Feng,, Chenzi Jiang,, Gubong Lim,, Cimini, L.J., Gang Feng,, Li, G.Y.

Journal:

IEEE Communications Surveys & Tutorials

Year:

2013

Language:

english

File:

PDF, 841 KB

english, 2013

3

Device-to-Device Communications Underlaying Cellular Networks

Feng, Daquan, Lu, Lu, Yuan-Wu, Yi, Li, Geoffrey Ye, Feng, Gang, Li, Shaoqian

Journal:

IEEE Transactions on Communications

Year:

2013

Language:

english

File:

PDF, 1.02 MB

english, 2013

4

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Wafer level warpage characterization for backside manufacturing processes of TSV interposers

Jiang, Feng, Wang, Qibin, Xue, Kai, Jing, Xiangmeng, Yu, Daquan, Shangguan, Dongkai

Year:

2014

Language:

english

File:

PDF, 2.58 MB

english, 2014

5

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Zhang, Mingchuan, Qiu, Delong, Jing, Xiangmeng, Jiang, Feng, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 772 KB

english, 2014

6

Single nanoparticle trapping based on on-chip nanoslotted nanobeam cavities

Yang, Daquan, Gao, Fei, Cao, Qi-Tao, Wang, Chuan, Ji, Yuefeng, Xiao, Yun-Feng

Journal:

Photonics Research

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

7

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Development of Laser-Induced Deep Etching Process for Through Glass Via

Chen, Li, Wu, Heng, Zhang, Mingchuan, Jiang, Feng, Yu, Tian, Yu, Daquan

Year:

2019

File:

PDF, 3.60 MB

2019

8

The effect of temporary bonding on post processing in TSV interposer manufacturing

Wang, Qibing, Yu, Daquan, Jiang, Feng, Liu, Haiyan, Jing, Xiangmeng

Journal:

Microsystem Technologies

Year:

2015

Language:

english

File:

PDF, 540 KB

english, 2015

9

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Zhang, Mingchuan, Qiu, Delong, Jing, Xiangmeng, Jiang, Feng, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 772 KB

english, 2014

10

Geochronology and geochemistry of the Carboniferous magmatism in the northern Great Xing’an Range, NE China: Constraints on the timing of amalgamation of Xing’an and Songnen blocks

Feng, Zhiqiang, Jia, Jie, Liu, Yongjiang, Wen, Quanbo, Li, Weimin, Liu, Binqiang, Xing, Daquan, Zhang, Li

Journal:

Journal of Asian Earth Sciences

Year:

2015

Language:

english

File:

PDF, 6.45 MB

english, 2015

11

High frequency characterization and analysis of through silicon vias and coplanar waveguides for silicon interposer

Wang, Huijuan, Ren, Xiaoli, Zhou, Jing, Pang, Cheng, Song, Chongsheng, Dai, Fengwei, Xue, Kai, Jiang, Feng, Yu, Daquan, Wan, Lixi

Journal:

Microsystem Technologies

Year:

2016

Language:

english

File:

PDF, 3.02 MB

english, 2016

12

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Jing, Xiangmeng, Wang, Qidong, Jiang, Feng, Cao, Liqiang, Yu, Daquan

Journal:

Microsystem Technologies

Year:

2016

Language:

english

File:

PDF, 1.27 MB

english, 2016

13

Exploiting full duplex for device-to-device communications in heterogeneous networks

Wang, Li, Tian, Fei, Svensson, Tommy, Feng, Daquan, Song, Mei, Li, Shaoqian

Journal:

IEEE Communications Magazine

Year:

2015

Language:

english

File:

PDF, 274 KB

english, 2015

14

Mode Switching for Energy-Efficient Device-to-Device Communications in Cellular Networks

Feng, Daquan, Yu, Guanding, Xiong, Cong, Yuan-Wu, Yi, Li, Geoffrey, Feng, Gang, Li, Shaoqian

Journal:

IEEE Transactions on Wireless Communications

Year:

2015

Language:

english

File:

PDF, 11.78 MB

english, 2015

15

In vitro anti-inflammatory activities of naucleoffieine H as a natural alkaloid from Nauclea officinalis Pierrc ex Pitard, through inhibition of the iNOS pathway in LPS-activated RAW 264.7 macrophages

Song, Shiqing, Liu, Pan, Wang, Liying, Li, Danna, Fan, Huaying, Chen, Daquan, Zhao, Feng

Journal:

Natural Product Research

Year:

2019

Language:

english

File:

PDF, 650 KB

english, 2019

16

The in vitro and in vivo anti-inflammatory effect of osthole, the major natural coumarin from Cnidium monnieri (L.) Cuss, via the blocking of the activation of the NF-κB and MAPK/p38 pathways

Fan, Huaying, Gao, Zhenfang, Ji, Kai, Li, Xin, Wu, Jingbao, Liu, Yue, Wang, Xuekai, Liang, Haiyue, Liu, Yanan, Li, Xiaoting, Liu, Pan, Chen, Daquan, Zhao, Feng

Journal:

Year:

2019

Language:

english

File:

PDF, 1.67 MB

english, 2019

17

Interference Geolocation in Satellite Communications Systems: An overview

Hao, Caiyong, Feng, Daquan, Zhang, Qinyu, Xia, Xiang-Gen

Journal:

IEEE Vehicular Technology Magazine

Year:

2020

File:

PDF, 772 KB

2020

18

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology

Ma, Shuying, Liu, Yi, Zheng, Fengxia, Li, Feng, Yu, Daquan, Xiao, Aimo, Yang, Xiaobing

Year:

2020

File:

PDF, 924 KB

2020

19

Sparing Organs at Risk with Simultaneous Integrated Boost Volumetric Modulated Arc Therapy for Locally Advanced Non-Small Cell Lung Cancer: An Automatic Treatment Planning Study

Wang, Daquan, Chen, Jiayun, Zhang, Xiaodong, Zhang, Tao, Wang, Luhua, Feng, Qinfu, Zhou, Zongmei, Dai, Jianrong, Bi, Nan

Journal:

Cancer Management and Research

Year:

2020

File:

PDF, 2.62 MB

2020

20

Factors influencing survival rate in adenoid cystic carcinoma of the salivary glands

Minxian Huang, Daquan Ma, Kaihua Sun, Guangyan Yu, Chuanbin Guo, Feng Gao

Journal:

International Journal of Oral & Maxillofacial Surgery

Year:

1997

Language:

english

File:

PDF, 433 KB

english, 1997

21

[IEEE 2013 IEEE Global Communications Conference (GLOBECOM 2013) - Atlanta, GA (2013.12.9-2013.12.13)] 2013 IEEE Global Communications Conference (GLOBECOM) - Optimal resource allocation for device-to-device communications in fading channels

Daquan Feng,, Lu Lu,, Yi Yuan-Wu,, Li, Geoffrey Ye, Gang Feng,, Shaoqian Li,

Year:

2013

Language:

english

File:

PDF, 508 KB

english, 2013

22

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Force transmitting element fabrication and characterization for MEMS tri-axial force sensor application

Hamidullah, Muhammad, Lim, Li Shiah, Noor, Shimul Jennifier, Yu, Daquan, Park, Woo Tae, Shao, Lichun, Ramakhrisna, Kotlanka, Feng, Hanhua

Year:

2010

Language:

english

File:

PDF, 2.29 MB

english, 2010

23

Design of novel multifunctional targeting nano-carrier drug delivery system based on CD44 receptor and tumor microenvironment pH condition

Chen, Daquan, Lian, Shengnan, Sun, Jingfang, Liu, Zongliang, Zhao, Feng, Jiang, Yongtao, Gao, Mingming, Sun, Kaoxiang, Liu, Wanhui, Fu, Fenghua

Journal:

Year:

2014

Language:

english

File:

PDF, 520 KB

english, 2014

24

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Design, simulation, and process development for 2.5D TSV interposer for high performance processer packaging

Ren, Xiaoli, Xue, Kai, Jiang, Feng, Wang, Qibing, Ping, Ye, Pang, Cheng, Liu, Haiyan, Xu, Cheng, Yu, Daquan, Shangguan, Dongkai

Year:

2013

Language:

english

File:

PDF, 975 KB

english, 2013

25

High sensitivity and high Q-factor nanoslotted parallel quadrabeam photonic crystal cavity for real-time and label-free sensing

Yang, Daquan, Kita, Shota, Liang, Feng, Wang, Cheng, Tian, Huiping, Ji, Yuefeng, Lončar, Marko, Quan, Qimin

Journal:

Applied Physics Letters

Year:

2014

Language:

english

File:

PDF, 1.51 MB

english, 2014

26

Joint Mode Selection and Resource Allocation for Device-to-Device Communications

Yu, Guanding, Xu, Lukai, Feng, Daquan, Yin, Rui, Li, Geoffrey Ye, Jiang, Yuhuan

Journal:

IEEE Transactions on Communications

Year:

2014

Language:

english

File:

PDF, 901 KB

english, 2014

27

[IEEE Multimedia Technology (IC-BNMT 2010) - Beijing, China (2010.10.26-2010.10.28)] 2010 3rd IEEE International Conference on Broadband Network and Multimedia Technology (IC-BNMT) - Enhancing role management in Role-Based Access Control

Xiaosheng Feng,, Bin Ge,, Yang Sun,, Zhenwen Wang,, Daquan Tang,

Year:

2010

Language:

english

File:

PDF, 982 KB

english, 2010

28

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - The study of backside TSV reveal process by direct Si/Cu grinding and polishing

Xue, Kai, Yu, Daquan, Li, Yuesheng, Jiang, Feng, Liu, Haiyan, Wang, Qibing, Dai, Fengwei

Year:

2013

Language:

english

File:

PDF, 1.18 MB

english, 2013

29

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling

Jing Zhou,, Daquan Yu,, Ran He,, Feng WeiDai,, Xueping Guo,, Chongshen Song,, HuiJuan Wang,, Guidotti, Daniel, Liqiang Cao,, Lixi Wan,

Year:

2011

Language:

english

File:

PDF, 1.04 MB

english, 2011

30

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Signal integrity analysis of a high-performance processor package with silicon interposer

Ren, Xiaoli, Pang, Cheng, Jiang, Feng, Qin, Zheng, Xue, Kai, Liu, Haiyan, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 954 KB

english, 2014

31

[IEEE 2013 IEEE 24th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC) - London, United Kingdom (2013.09.8-2013.09.11)] 2013 IEEE 24th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC) - User selection based on limited feedback in device-to-device communications

Feng, Daquan, Lu, Lu, Yuan-Wu, Yi, Li, Geoffrey Ye, Feng, Gang, Li, Shaoqian

Year:

2013

Language:

english

File:

PDF, 182 KB

english, 2013

32

[IEEE 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010) - Buenos Aires (2010.08.31-2010.09.4)] 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology - Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications

Liang Lou,, Ramakrishna, Kotlanka, Lichun Shao,, Woo-Tae Park,, Daquan Yu,, Lishiah Lim,, Yongjun Wee,, Kripesh, Vaidyanathan, Hanhua Feng,, Chua, Benjamin S Y, Chengkuo Lee,, Dim-Lee Kwong,

Year:

2010

Language:

english

File:

PDF, 1.02 MB

english, 2010

33

[IEEE 2014 IEEE Global Conference on Signal and Information Processing (GlobalSIP) - Atlanta, GA, USA (2014.12.3-2014.12.5)] 2014 IEEE Global Conference on Signal and Information Processing (GlobalSIP) - Mode switching for device-to-device communications in cellular networks

Feng, Daquan, Yu, Guanding, Yuan-Wu, Yi, Li, Geoffrey Ye, Feng, Gang, Li, Shaoqian

Year:

2014

Language:

english

File:

PDF, 204 KB

english, 2014

34

Neurocytoma of the pituitary gland: A case report and literature review

Peng, Peng, Chen, Feng, Zhou, Daquan, Liu, Handong, Li, Jingwen

Journal:

Biomedical Reports

Year:

2015

Language:

english

File:

PDF, 742 KB

english, 2015

35

High-efficient synthesis and biological activities of allosamidins

Huang, Gangliang, Peng, Daquan, Mei, Xinya, Chen, Xin, Xiao, Feng, Tang, Qilin

Journal:

Journal of Enzyme Inhibition and Medicinal Chemistry

Year:

2014

Language:

english

File:

PDF, 273 KB

english, 2014

36

QoS-Aware Resource Allocation for Device-to-Device Communications With Channel Uncertainty

Feng, Daquan, Lu, lu, Yuan-Wu, Yi, Li, Ye, Feng, Gang, Li, Shaoqian

Journal:

IEEE Transactions on Vehicular Technology

Year:

2015

Language:

english

File:

PDF, 11.84 MB

english, 2015

37

[ASME 2012 9th International Pipeline Conference - Calgary, Alberta, Canada (Monday 24 September 2012)] Volume 1: Upstream Pipelines; Project Management; Design and Construction; Environment; Facilities Integrity Management; Operations and Maintenance; Pipeline Automation and Measurement - Analyzing the Crash Between Gauging Pig and the Elbows of U-Shaped Pipeline

Li, Daquan, Zhang, Peng, Ai, Muyang, Zheng, Jianguo, Yan, Feng, Wang, Yubin

Year:

2012

Language:

english

File:

PDF, 253 KB

english, 2012

38

[IEEE 2015 IEEE 82nd Vehicular Technology Conference (VTC Fall) - Boston, MA, USA (2015.9.6-2015.9.9)] 2015 IEEE 82nd Vehicular Technology Conference (VTC2015-Fall) - Optimal Mobile Association in Device-to-Device-Enabled Heterogeneous Networks

Xiao, Sa, Feng, Daquan, Yuan-Wu, Yi, Li, Geoffrey Ye, Guo, Wei, Li, Shaoqian

Year:

2015

Language:

english

File:

PDF, 225 KB

english, 2015

39

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Assembly process development of 2.5D integration for high performance processer

Liu, Haiyan, Jiang, Feng, Xue, Kai, Yu, Daquan, Liu, Xiaoyang

Year:

2015

Language:

english

File:

PDF, 928 KB

english, 2015

40

[IEEE 2010 Symposium on Photonics and Optoelectronics (SOPO 2010) - Chengdu, China (2010.06.19-2010.06.21)] 2010 Symposium on Photonics and Optoelectronics - Feasibility of Using Tissue-Equivalent Materials to Study Laser-Tissue Interaction Effects for High Intensity Laser Beams

Fu, Yuchuan, Tang, Bin, Lin, Daquan, Lin, Daguan, Feng, Chen, Yao, Ke, Feng, Guoying, Feng, Chen, Yao, Ke, Feng, Guoying

Year:

2010

File:

PDF, 881 KB

2010

41

[IEEE 2013 International Conference on Communications, Circuits and Systems (ICCCAS) - Chengdu, China (2013.11.15-2013.11.17)] 2013 International Conference on Communications, Circuits and Systems (ICCCAS) - Buffer aware routing for resource-constrained DTNs

Feng, Daquan, Feng, Gang, Shuang, Qin

Year:

2013

Language:

english

File:

PDF, 328 KB

english, 2013

42

[IEEE 2010 Symposium on Photonics and Optoelectronics (SOPO 2010) - Chengdu, China (2010.06.19-2010.06.21)] 2010 Symposium on Photonics and Optoelectronics - Feasibility of Using Tissue-Equivalent Materials to Study Laser-Tissue Interaction Effects for High Intensity Laser Beams

Fu, Yuchuan, Tang, Bin, Lin, Daquan, Lin, Daguan, Feng, Chen, Yao, Ke, Feng, Guoying, Feng, Chen, Yao, Ke, Feng, Guoying

Year:

2010

Language:

english

File:

PDF, 881 KB

english, 2010

43

[IEEE 2016 International Conference on Computing, Networking and Communications (ICNC) - Kauai, HI, USA (2016.2.15-2016.2.18)] 2016 International Conference on Computing, Networking and Communications (ICNC) - Energy-efficient mobile association in device-to-device-enabled heterogeneous networks

Xiao, Sa, Zhou, Xiangwei, Feng, Daquan, Yuan-Wu, Yi, Li, Geoffrey Ye, Guo, Wei

Year:

2016

Language:

english

File:

PDF, 233 KB

english, 2016

44

Energy-Efficient Mobile Association in Heterogeneous Networks with Device-to-Device Communications

XIAO, SA, Zhou, Xiangwei, Feng, Daquan, Yuan-Wu, Yi, Ye Li, Geoffrey, Guo, Wei

Journal:

IEEE Transactions on Wireless Communications

Year:

2016

Language:

english

File:

PDF, 1.14 MB

english, 2016

45

Curcumin and its major metabolites inhibit the inflammatory response induced by lipopolysaccharide: Translocation of nuclear factor-κB as potential target

Zhao, Feng, Gong, Yudian, Hu, Yuan, Lu, Minghui, Wang, Jing, Dong, Jianxin, Chen, Daquan, Chen, Lei, Fu, Fenghua, Qiu, Feng

Journal:

Molecular Medicine Reports

Year:

2014

Language:

english

File:

PDF, 672 KB

english, 2014

46

Multifunctional Layered Gadolinium Hydroxide Nanoplates for Ultrahigh Field Magnetic Resonance Imaging, Computed Tomography and Fluorescence Bioimaging

Wu, Min, Li, Lei, Yu, Xuefeng, Zhang, Daquan, Sun, Tianying, Li, Xue, Sun, Ling, Lui, Su, Huang, Xiaoqi, Bi, Feng, Wang, Huaiyu, Zhu, Hongyan, Gong, Qiyong

Journal:

Journal of Biomedical Nanotechnology

Year:

2014

Language:

english

File:

PDF, 8.64 MB

english, 2014

47

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Signal integrity analysis of a high-performance processor package with silicon interposer

Ren, Xiaoli, Pang, Cheng, Jiang, Feng, Qin, Zheng, Xue, Kai, Liu, Haiyan, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 954 KB

english, 2014

48

[IEEE GLOBECOM 2015 - 2015 IEEE Global Communications Conference - San Diego, CA, USA (2015.12.6-2015.12.10)] 2015 IEEE Global Communications Conference (GLOBECOM) - Energy-Efficient Power Control for Wireless Interference Networks

Xu, Lukai, Yu, Guanding, Feng, Daquan, Li, Geoffrey Ye, Zhang, Huazi

Year:

2014

Language:

english

File:

PDF, 265 KB

english, 2014

49

Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Ren, Xiaoli, Pang, Cheng, Qin, Zheng, Ping, Ye, Jiang, Feng, Xue, Kai, Liu, Haiyan, Yu, Daquan

Journal:

Journal of Semiconductors

Year:

2016

Language:

english

File:

PDF, 3.33 MB

english, 2016

50

Energy Efficiency Tradeoff in Interference Channels

Yu, Guanding, Xu, Lukai, Feng, Daquan, Zhang, Zhaoyang, Li, Geoffrey, Zhang, Huazi

Journal:

Year:

2016

Language:

english

File:

PDF, 8.00 MB

english, 2016